PMC

Representative ASOCT images showing the trephine incisions after FSL trephination with different interfaces and different levels of energy. Flat interface with 30% energy (a), flat interface with 90% energy (b), flat interface with 150% energy (c), liquid interface with 30% energy (d), liquid interface with 90% energy (e), and liquid interface with 150% energy (f).

The red dots represent the RelaxedNative ensembles(Results). The interface RMSD is shown on the x-axis, the interface energy on the y-axis. The same energy range is used for displaying both, shotgun sampling (blue) and ReplicaDock (black), results of each target, respectively. The vertical gray lines correspond to I_rms of 5.0 Å, and the two horizontal gray lines correspond to interface energy −4 and −8 Rosetta Energy Units.

(a) The hysteresis dissipated energy versus interface shear stress curves of matrix cracking mode 3 and mode 5 when V_f = 40%; (b) the interface debonded length 2L_d/L versus interface shear stress curves of matrix cracking mode 3 and mode 5 when V_f = 40%; (c) the hysteresis dissipated energy versus interface shear stress curves of matrix cracking mode 3 and mode 5 when V_f = 45%; (d) the interface debonded length 2L_d/L versus interface shear stress curves of matrix cracking mode 3 and mode 5 when V_f = 45%; (e) the hysteresis dissipated energy versus interface shear stress curves of matrix cracking mode 3 and mode 5 when V_f = 50%; (f) the interface debonded length 2L_d/L versus interface shear stress curves of matrix cracking mode 3 and mode 5 when V_f = 50%; and (g) the composite hysteresis dissipated energy versus interface shear stress curve when V_f = 40%, 45% and 50%, and η = 0.2.

(a) The hysteresis dissipated energy versus interface shear stress curves of matrix cracking mode 3 and mode 5 when σ_max = 150 MPa; (b) the interface debonded length 2L_d/L versus interface shear stress curves of matrix cracking mode 3 and mode 5 when σ_max = 150 MPa; (c) the hysteresis dissipated energy versus interface shear stress curves of matrix cracking mode 3 and mode 5 when σ_max = 200 MPa; (d) the interface debonded length 2L_d/L versus interface shear stress curves of matrix cracking mode 3 and mode 5 when σ_max = 200 MPa; (e) the hysteresis dissipated energy versus interface shear stress curves of matrix cracking mode 3 and mode 5 when σ_max = 250 MPa; (f) the interface debonded length 2L_d/L versus interface shear stress curves of matrix cracking mode 3 and mode 5 when σ_max = 250 MPa; and (g) the composite hysteresis dissipated energy versus interface shear stress curves when σ_max = 150, 200 and 250 MPa, and η = 0.2.